UNIMICRON TECHNOLOGY Business Summary

Unimicron Technology Corp operates a high-volume manufacturing business model, generating revenue through the design and production of advanced interconnect solutions for the global semiconductor and electronics industries. Its primary business segments are categorized into IC Substrates—specifically Ajinomoto Build-up Film (ABF) and Bismaleimide Triazine (BT) substrates—High-Density Interconnect (HDI) boards, and conventional Printed Circuit Boards (PCBs). The company capitalizes on the surging demand for High-Performance Computing (HPC), AI accelerators, and 5G infrastructure by supplying critical packaging materials that facilitate high-speed data transmission. In the competitive landscape, Unimicron competes directly with Japan’s Ibiden and Shinko Electric, as well as South Korea’s Samsung Electro-Mechanics (SEMCO) and domestic rival Nan Ya PCB. As of early 2026, Unimicron maintains its position as a global leader in ABF substrate capacity, serving as a primary strategic partner for top-tier chipmakers like Intel, AMD, and Nvidia, while leveraging its scale to maintain a dominant market share in the high-end substrate segment. Founded in 1990 as a strategic spin-off from United Microelectronics Corporation (UMC), Unimicron is led by Chairman T.J. Tseng (Tzu-Hsien Tseng), a veteran of the Taiwanese semiconductor industry who has overseen the company’s transition from a standard PCB manufacturer to a global substrate powerhouse. The executive leadership team includes President of the Substrate Business Group, Michael Shen, and President of the PCB Business Group, David Ho, both of whom bring decades of technical expertise in materials science and advanced manufacturing processes. The company’s strategic direction is heavily influenced by its lineage with UMC, which remains a significant institutional investor and maintains a presence on the board. Other notable board members include representatives from the broader Taiwanese tech ecosystem, ensuring deep integration with the global foundry and packaging supply chain. This pedigree of semiconductor manufacturing excellence allows Unimicron to maintain the rigorous R&D cycles necessary for next-generation chiplet architectures and advanced packaging technologies.