ALPHAPORT.AI
🇹🇼GRAND PLASTIC TECHNOLOGY CORP3131
TWDUSD
SectorInformation TechnologyIndustryTech HardwareWebsitehttps://www.gptc.com.tw/
Management
張鴻泰
CEO

Company information

Ticker
3131
Country
Taiwan
Sector
Information Technology
Industry
Tech Hardware

GRAND PLASTIC TECHNOLOGY Business Summary

Grand Process Technology Corp (3131.TWO), often referred to as Grand Plastic Technology, is a premier Taiwan-based semiconductor equipment manufacturer specializing in advanced wet processing solutions. The company generates revenue primarily through the design, manufacturing, and after-sales servicing of high-precision equipment, including single-wafer spin processors, batch-type wet bench systems, and combo systems. Its business is segmented into equipment sales, chemical supply systems, and technical maintenance services, with a strategic focus on advanced IC packaging (CoWoS), compound semiconductors, and silicon wafer manufacturing. GPTC maintains a dominant market position in the wet-processing niche, holding a near-monopoly in Taiwan for 12-inch dry film strippers used in solder bump processes. It competes directly with global giants such as Applied Materials, Lam Research, Tokyo Electron, and SCREEN Holdings, distinguishing itself through deep integration with tier-one foundries like TSMC and OSAT leaders like ASE Technology. Founded in 1993 and headquartered in Hsinchu, the company is led by a veteran executive team with deep roots in the semiconductor ecosystem. As of early 2026, the leadership team is headed by Chairman Robin Chang and CEO Hoton Chang, who transitioned from his long-standing role as Chairman to oversee executive operations. Key leadership also includes President Ben-Li (Kevin) Shih, a semiconductor veteran with over 30 years of experience in process development and foundry operations who previously served as General Manager. The leadership team is supported by a robust engineering core that holds over 100 manufacturing process patents. GPTC is publicly traded on the Taipei Exchange and is a critical component of the global AI hardware supply chain due to its essential role in enabling high-density packaging for next-generation accelerators.

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