KINSUS INTERCONNECT TECHNOLOGY COR Business Summary

Kinsus Interconnect Technology Corp. (3189.TW) is a premier global manufacturer of integrated circuit (IC) substrates, generating revenue through the high-volume fabrication and sale of advanced packaging materials for the semiconductor industry. The company operates primarily through its IC Substrate segment, which is bifurcated into Ajinomoto Build-up Film (ABF) substrates—targeting high-performance computing (HPC), AI accelerators, and networking—and Bismaleimide Triazine (BT) substrates, which serve the mobile, memory, and RF module markets. As of early 2026, Kinsus has aggressively expanded its market position by committing NT$23.5 billion to ABF capacity expansion to meet surging demand for AI server components. The company competes directly with industry leaders such as Unimicron Technology, Nan Ya PCB, Ibiden, and Shinko Electric Industries, maintaining its status as a critical member of Taiwan’s "Big Three" substrate providers by leveraging high-mix, high-value manufacturing capabilities. Founded in 2000, Kinsus is led by Chairman Tzu-Hsien (T.H.) Tung, a seminal figure in the Taiwanese technology sector and co-founder of ASUSTeK Computer Inc. who also serves as Chairman of Pegatron Corporation. The current executive management team is headed by CEO and President Scott Chen, a Motorola veteran with a background in physics from National Tsing Hua University, alongside Chief Technology Officer Jeff Chang and Executive Vice President Louis Chiang. The company’s strategic direction is heavily influenced by its parent organization, Pegatron Corporation, which remains the dominant institutional shareholder. The board of directors includes high-level Pegatron executives such as Sih-Jheng Liao, ensuring that Kinsus remains deeply integrated within the Pegatron/ASUS ecosystem, providing the firm with robust financial backing and a stable, high-tier global customer base.