Company information
- Ticker
- 3372
- Country
- Taiwan
- Sector
- Information Technology
- Industry
- Semiconductors
TICP Business Summary
Taiwan IC Packaging Corporation (TICP) operates as a specialized Outsourced Semiconductor Assembly and Test (OSAT) provider, generating revenue through high-volume integrated circuit packaging and testing services. The company’s business model is centered on two primary segments: lead-frame packaging, including thin small-outline (TSOP), small-outline (SOP), and quad flat (QFP) packages, and substrate-based solutions such as Land Grid Array (LGA), Ball Grid Array (BGA), and specialized memory card formats like micro-SD and SD cards. TICP differentiates itself through the development of optical and ultrathin IC technologies tailored for consumer electronics, power management, and wireless communication sectors. Within the competitive landscape, TICP operates alongside industry giants like ASE Technology Holding and Powertech Technology (PTI), as well as direct mid-tier rivals such as Lingsen Precision Industries and Orient Semiconductor Electronics (OSE). TICP maintains a niche market position by focusing on high-density memory packaging and maintaining strategic "green partner" certifications with global OEMs like Samsung and Sony. Leadership is spearheaded by Chairman Shu Chung Won and General Manager (CEO) Chung-Ho Tseng, who also serves as the company's primary spokesman. Tseng brings significant industry pedigree to the role, having previously served as Vice President of Transcend Information, Inc., a major institutional shareholder and strategic partner that maintains a significant stake in TICP. The executive team is supported by Vice President of Operations Su Jun Ren and Vice President of Sales Guo Ping, both of whom oversee the company's manufacturing facilities in Kaohsiung. The Board of Directors includes notable members such as Executive Director Shu Zheng and Independent Director Zhang Xiang, reflecting a governance structure closely aligned with its primary institutional investors. As of March 2026, the leadership remains focused on aligning capacity with the AI-driven semiconductor investment cycle and expanding its footprint across the Americas and broader Asian markets.