XINTEC Business Summary

Xintec Inc. (3374.TWO) operates as a specialized outsourced semiconductor assembly and testing (OSAT) provider, generating revenue through manufacturing service fees for advanced wafer-level packaging and testing. The company’s business is structured into three primary segments: Wafer Level Chip Scale Packaging (WLCSP) for image and biometric sensors, Wafer Level Post-passivation Interconnect (WLPPI) for power and RF components, and specialized wafer testing services. As a strategic subsidiary of TSMC, Xintec functions as a high-end niche player, often managing specialized "More-than-Moore" packaging requirements for automotive and consumer electronics. It competes with global OSAT giants like ASE Technology Holding and Amkor Technology, as well as regional specialists like Kingpak Technology and China Wafer Level CSP, maintaining a competitive edge through its exclusive integration with TSMC’s foundry workflows. Incorporated in 1998, Xintec is led by Chairman and President Chia-Hsiang (CH) Chen, a TSMC veteran who has served as the company's chief executive since 2017 following a career as a Fab Director and senior manager within the TSMC group. The leadership team includes Vice President and CFO Simon Lin, who oversees financial strategy and investor relations. The company’s board is anchored by its parent company, TSMC, which maintains a 41.01% controlling interest and provides strategic oversight through representatives such as Dr. C.S. Yoo. Major institutional shareholders include Cathay Life Insurance, BlackRock, and Vanguard, reinforcing Xintec’s position as a stable, institutional-grade component of the global semiconductor supply chain.