TONG HSING ELECTRONIC INDUSTRIES L Business Summary

Tong Hsing Electronic Industries Ltd. (6271.TW) operates as a premier provider of microelectronic packaging and ceramic substrate foundry services, generating revenue through the manufacture and sale of high-reliability components for specialized industries. The company’s business is divided into four primary segments: Ceramic Metalized Substrates (utilizing DPC, DBC, and AMB technologies), CMOS Imaging Products (including wafer reconstruction and testing), Radio Frequency (RF) Modules, and Hybrid Integrated Circuits. Serving high-growth sectors such as automotive, aerospace, medical electronics, and 5G communications, Tong Hsing maintains a competitive edge by focusing on niche, high-power dissipation and high-frequency applications. Its primary direct competitors include Kyocera, ASE Technology Holding, and Amkor Technology; within this landscape, Tong Hsing occupies a dominant position as a leading global supplier of ceramic substrates for high-brightness LEDs and automotive image sensor packaging. Founded in 1974, the company is currently led by Chairman Tai-Ming (Pierre) Chen, a renowned industry veteran and the founder of Yageo Corporation, who assumed the role following a strategic alignment with the Yageo Group. The executive leadership includes General Manager Shao-Ping (Heinz) Lu, who has directed operations since 2013, alongside Deputy Chairman Hsi-Hu (Kevin) Lai and COO/CFO Jia-Li Huang, both of whom possess deep expertise in semiconductor finance and operations from the Kingpak Technology merger. The company’s board and ownership structure are heavily influenced by the Yageo ecosystem, with Kaimei Electronic Corp serving as a major shareholder. Other notable institutional investors include Fubon Life Insurance and The Vanguard Group, reflecting the company’s stability and strategic importance within the global electronics supply chain.