Company information
- Ticker
- 7772
- Country
- Taiwan
- Sector
- Information Technology
- Industry
- Semiconductors
MOE Business Summary
Moe Design Inc. (7772.TWO) is a Taiwan-based technology firm specializing in advanced thermal management solutions for high-performance computing and semiconductor applications. The company generates revenue through the design, manufacture, and B2B sale of high-efficiency heat spreaders (IHS), integrated vapor chambers (VC), and liquid cooling modules. Its primary business segments are categorized into AI/GPU cooling solutions, data center thermal infrastructure, and new energy vehicle (NEV) charging components. Moe Design leverages its proprietary "X-Forge" (X鍛打) technology to produce high-density thermal components that offer superior heat dissipation and structural integrity compared to traditional casting or machining. In the competitive landscape, the company contends with established Taiwanese thermal giants such as Asia Vital Components (AVC), Auras Technology, and Sunonwealth Electric Machine (Sunon). Moe Design occupies a specialized niche as a high-end, design-led provider focusing on the critical heat dissipation requirements of next-generation AI chips and high-power electronics. The company is led by Founder, Chairman, and General Manager Chih-Hao (Howard) Chen, a veteran engineer with extensive experience in mechanical design and materials science. Under Chen’s leadership, Moe Design transitioned from its 2010 origins in audio product design to become a critical player in the semiconductor cooling supply chain. The executive team possesses a strong pedigree in precision forging and thermal engineering, which has been instrumental in securing partnerships with leading global chip and server manufacturers. The company’s board of directors includes strategic industry advisors who oversee its growth on the Taipei Exchange’s Emerging Stock Market. As of early 2026, the leadership is focused on scaling production capacity to meet the surging demand for liquid cooling in AI-driven data centers, positioning the firm as a key enabler of high-density computing infrastructure.