CHIPMOS TECHNOLOGIES Business Summary

ChipMOS Technologies Inc. operates as a leading provider of outsourced semiconductor assembly and test (OSAT) services, generating revenue through fee-based contracts for the back-end processing of high-density memory and display driver integrated circuits (DDIC). The company’s revenue streams are diversified across four primary segments: Testing (memory and logic/mixed-signal), Assembly (packaging), Wafer Bumping, and specialized DDIC services including Chip-on-Glass (COG) and Chip-on-Film (COF) technologies. By focusing on high-growth end-markets such as automotive electronics, OLED mobile displays, and industrial IoT, ChipMOS maintains a critical position in the global semiconductor supply chain. Within the competitive landscape, ChipMOS is a dominant niche leader in the DDIC and memory sectors, trailing diversified global giants ASE Technology Holding and Amkor Technology in total scale, while competing directly for market share with Powertech Technology (PTI) in memory packaging and King Yuan Electronics (KYEC) in testing services. The company is led by Chairman and President Shih-Jye (S.J.) Cheng, a founding member who has directed the firm’s strategy since 1997 and brings extensive technical pedigree from his previous tenure at Mosel Vitelic. The executive leadership team includes Chief Financial Officer Silvia Su, who oversees the company’s dual-listing financial compliance, and Executive Vice President Jesse Huang, who manages global operations and capacity expansion. ChipMOS was originally established as a spin-off from Mosel Vitelic, and its governance is supported by a board of directors featuring industry veterans such as Dr. Jeng-Sheng Huang. The company’s institutional investor base is characterized by significant holdings from global asset managers including BlackRock, The Vanguard Group, and Dimensional Fund Advisors, reflecting its status as a stable, high-yield constituent of the Taiwan semiconductor ecosystem.