CHIPMOS TECHNOLOGIES Business Summary

ChipMOS TECHNOLOGIES INC. (IMOS) operates as a leading provider of outsourced semiconductor assembly and test (OSAT) services, generating revenue primarily through service fees for high-precision back-end manufacturing. The company’s business is diversified across four primary segments: Testing Services (memory and mixed-signal ICs), Assembly Services (advanced packaging including BGA and TSOP), Bumping Services (gold and solder bumping for display drivers), and comprehensive Turnkey Solutions. As of early 2026, ChipMOS maintains a dominant market position in the memory and display driver IC (DDIC) sectors, benefiting from robust demand in AI data centers and automotive electronics. Its primary direct competitors include ASE Technology Holding Co., Ltd., Amkor Technology, Inc., and Powertech Technology Inc. Within this landscape, ChipMOS distinguishes itself as a top-10 global OSAT player with a specialized focus on high-utilization memory and OLED display driver back-end processing. The company is led by Chairman and President Shih-Jye Cheng, who has served as the chief executive since the firm’s inception in 1997 and holds an MBA from Saginaw Valley State University. Supporting the executive tier is CFO Shou-Kang Chen, a veteran of the company since 2000 with a Ph.D. from National Cheng Kung University, who has overseen the firm’s financial strategy and investor relations since 2005. The leadership team is complemented by a board featuring seasoned industry experts such as Independent Director Yuh-Fong Tang, former CEO of Myson Century. Notable institutional backing includes a significant 11.4% stake held by industry giant ASE Technology Holding Co., Ltd., alongside major positions from global asset managers including The Vanguard Group, BlackRock, and Renaissance Technologies.