FLEXIUM INTERCONNECT Business Summary

Flexium Interconnect Inc. (6269.TW) operates as a leading manufacturer of high-density flexible printed circuit boards (FPCBs) and copper-clad laminates, generating revenue primarily through the fabrication and assembly of single-sided, double-sided, multilayer, and rigid-flex circuits. The company’s business is divided into two reportable segments: the Printed Circuit Board segment, which accounts for the vast majority of turnover via the production of high-frequency transmission components for smartphones, wearables, and laptops; and the Other segment, which focuses on radio frequency integrated circuits (RFICs) and integrated video systems. As of early 2026, Flexium is strategically pivoting its market position toward the AI server and robotics sectors to offset volatility in the consumer electronics market. It competes directly with major industry players such as Zhen Ding Technology, Career Technology, Multi-Fineline Electronix (MFLEX), and Sumitomo Electric, positioning itself as a specialized provider of advanced high-frequency transmission solutions for next-generation hardware architectures. Founded in December 1997 by current Chairman Walter Cheng (Ming-Chi Cheng), the company is currently undergoing a leadership-led transformation to integrate AI-driven manufacturing and product design. The executive team is headed by CEO and General Manager David Cheng, an American professional manager appointed in May 2025 who previously served as the Chairman of Rafael Micro and holds an electrical engineering degree from the University of California, Irvine. Supporting the leadership are key executives including CFO Arthur Shiung, formerly of the ASE Group, and CQO Yu-Hong Lu. The company’s board is characterized by a mix of long-tenured industry veterans and technical experts, with significant institutional backing from major shareholders such as SinoPac Securities Investment Trust, Mega International Investment Trust, and JPMorgan Chase & Co.